Heliotek ServerCore SC-7920 Motherboard

Heliotek Electronics GmbH

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-SC7920

Specs HeadlineDual SP5 (EPYC 9004/9005) • 24× DDR5-4800 ECC RDIMM • 4× PCIe Gen5 x16 • OCP NIC 3.0 • Redfish BMC

Bill Of MaterialsPCB: 16-layer high-Tg FR4 (AT&S) — VRM: Renesas/Infineon multi-phase — BMC: ASPEED AST2600 — Memory routing: 24× DDR5 RDIMM slots — PCIe retimers: Astera Labs — TPM 2.0: Infineon SLB9672 — Connectors: TE Connectivity

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesPCB: AT&S (Leoben, AT) — VRM: Renesas (Düsseldorf, DE) + Infineon (Munich, DE) — BMC: ASPEED Technology (Hsinchu, TW) — Connectors: TE Connectivity (Bensheim, DE) — Memory slots: Foxconn Interconnect — Assembly: Heliotek Munich-Riem (CM-free, in-house SMT)

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III ITE).

Recycling InstructionsWEEE Annex II category 3 (large IT equipment). Returns to Heliotek industrial reclaim line for full board-level material recovery. Gold and palladium recovery rate exceeds 95% under current EU best-available-techniques.

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Wygenerowano przez QRabl

Heliotek ServerCore SC-7920 Motherboard

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Authorized information

Product Passport — Electronics DPP (ESPR)