Heliotek HomeHub H-200

Heliotek Electronics GmbH

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

Pack / Product Data

Ce MarkingCE marked — EU DoC ref. HEL-DoC-2026-HH200

Specs HeadlineMatter 1.3 over Thread 1.4 • Zigbee 3.0 • Z-Wave 800 • PoE 802.3af • Local API + MQTT • Linux LTS

Bill Of MaterialsSoC: NXP i.MX 8M Plus (Cortex-A53 + NPU) — RAM: 2 GB LPDDR4 — Storage: 16 GB eMMC + 256 MB NOR — Thread/Zigbee radio: Silicon Labs EFR32MG24 — Z-Wave: Silicon Labs ZGM230S — Enclosure: 100% recycled ABS+PC — PCB: 4-layer FR4 (AT&S)

Manufacturer NameHeliotek Electronics GmbH

Manufacturing Date2026-03-15

Manufacturing PlaceMunich, Germany

Supplier IdentitiesSoC: NXP Semiconductors (Hamburg, DE) — Wireless: Silicon Labs (Austin, USA + Norwegian R&D) — Enclosure: Polykemi recycled-plastics line (Ystad, SE) — PCB: AT&S (Leoben, AT) — Assembly: Heliotek Munich

Manufacturer AddressRosenheimer Straße 145, 81671 München, Germany

Hazard ClassificationNo hazardous classification (Class III low-voltage equipment).

Recycling InstructionsWEEE category 4 (small consumer equipment). Return to Heliotek retail partner or municipal WEEE collection. Recycled-plastic enclosure can be reprocessed alongside other ABS/PC streams.

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Heliotek HomeHub H-200

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Product Passport — Electronics DPP (ESPR)